Precision in Semiconductor CMP Processing
Chemical Mechanical Polishing (CMP) is a critical step in semiconductor manufacturing, used to achieve ultra-flat, smooth, and defect-free wafer surfaces. Polyethyleneimine (PEI) is a highly effective additive in CMP slurries, valued for its strong cationic charge, which enhances abrasive particle stability, controls surface interactions, and helps prevent agglomeration for consistent, high-performance planarization.
High-Purity PAA for Superior Slurry Performance
Polysciences has developed proprietary manufacturing processes to produce highly purified Poly(Acrylic Acid), PAA, with low ionic and particulate content. Our stringent purification methods ensure optimal dispersion, making our PAA ideal for use in high-performance CMP slurry formulations.
Product Highlights
Polysciences' Poly(acrylic acid) (PAA) and Polyethyleneimine (PEI) polymers are engineered to enhance performance across the Chemical Mechanical Planarization (CMP) process. Together, they deliver charge control, dispersion stability, and surface interaction optimization, making them ideal additives in CMP slurries.
POLY(ACRYLIC ACID)
Down Force & Wafer Carrier:
Maintains abrasive dispersion under pressure, ensuring uniform material removal.
Polishing Pad & Rotating Plate:
Enhances slurry flow and lubricity, reducing pad glazing and extending pad life.
Slurry Dispenser:
Acts as a rheology modifier to prevent sedimentation and ensure consistent delivery.
Wafer:
Provides controlled chemical reactivity for precise, low-defect polishing.
Polishing Slurry:
Functions as an effective abrasive dispersant and pH buffer.
Down Force & Wafer Carrier:
Balances surface charge and reduces defectivity, especially on sensitive materials.
Polishing Pad & Rotating Plate:
Improves pad interaction and helps stabilize slurry under high-speed rotation.
Slurry Dispenser:
Enhances long-term slurry stability and resists microbial contamination.
Wafer:
Offers selective binding and passivation, minimizing corrosion and over-polishing.
Polishing Slurry:
Works synergistically with PAA to stabilize particles and fine-tune surface interactions.
